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Open Access Article

International Journal of Materials Science. 2023; 5: (1) ; 5-9 ; DOI: 10.12208/j.ijms.20220012.

The COB packaging technology of the e-cigarette chip
电子烟芯片的COB封装技术

作者: 蒋金元 *

深圳市炬灿微电子科技有限公司 广东深圳

*通讯作者: 蒋金元,单位:深圳市炬灿微电子科技有限公司 广东深圳;

发布时间: 2022-12-30 总浏览量: 826

摘要

由于电子烟在全球范围内已经普及,从国家和地方政府对于电子烟的态度来看,更倾向于鼓励其发展,因此对电子烟路由、电池供电这类技术要求也更高。但随着近年来国内电子烟具产品数量及市场规模的不断扩大,电子烟制造的成本将逐渐上升,为缓解这一问题,生产出经济型、环保型电子雾芯成为必然趋势。在这样的背景下,如何实现低成本、高性能的电子烟产品更具竞争力将成为电子烟厂的一大挑战。目前市面上常见的半导体封装有热插拔、封装金属化等多项技术,但受限于制造工艺能力及封装成本等问题无法满足客户对不同尺寸化产品的差异化需求。为了能够让电子烟在满足高可靠性及高性能要求情况下实现较小芯片尺寸。

关键词: 电子烟芯片;封装技术;COB

Abstract

Since e-cigarettes have been popularized around the world, national and local governments tend to encourage e-cigarette development, so the technical requirements such as e-cigarette routing and battery power supply are also higher. However, with the continuous expansion of the number and market scale of domestic e-cigarette products in recent years, the cost of e-cigarette manufacturing will gradually rise. In order to alleviate this problem, the production of economic and environmentally friendly electronic fog core has become an inevitable trend. In this context, how to achieve low-cost, high-performance e-cigarette products are more competitive will become a big challenge for e-cigarette factories. At present, there are many common semiconductor packaging technologies on the market, such as hot plug and packaging metallization, but limited by the manufacturing process capacity and packaging cost, they cannot meet the differentiated needs of customers for different sizes of packaging products. To enable e-cigarettes to achieve a smaller chip size with high reliability and high performance requirements.

Key words: e-cigarette chip; packaging technology; COB

参考文献 References

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引用本文

蒋金元, 电子烟芯片的COB封装技术[J]. 国际材料科学通报, 2023; 5: (1) : 5-9.