Research on precise improvement technology for plastic encapsulation scratch problems based on semiconductor packaging grinding equipment systems
基于半导体封装研磨设备系统的塑封体划伤问题精准改善技术探究

摘要

半导体封装行业指纹产品，后道塑封体研磨工艺主要塑封体表面处理，对指纹接触的表面进行特殊处理，以提高指纹图像的采集质量和识别准确性。研磨设备主要用于IC整条塑封后对塑封体多余材料的去除与表面平整化处理，其工作原理基于研磨原理，通过磨具与塑封体表面的相对运动来实现材料去除。

Abstract

For fingerprint products in the semiconductor packaging industry, the post-plastic encapsulation grinding process mainly involves surface treatment of the plastic encapsulation. Special treatment is carried out on the surface in contact with fingerprints to improve the acquisition quality and recognition accuracy of fingerprint images. Grinding equipment is mainly used for the removal of excess materials and surface leveling treatment of the entire IC after plastic packaging. Its working principle is based on the grinding principle, and material removal is achieved through the relative movement between the grinding tool and the surface of the plastic packaging.